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BGS13SL9 wideband rf sp3t switch data sheet revision 2.4, 2014-05-27 p ower management & multimarket
edition may 27, 2014 published by in?neon technologies ag 81726 munich, germany c 2012 in?neon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, in?neon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest in?neon technologies of?ce ( www.in?neon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest in?neon technologies of?ce. in?neon technologies components may be used in life-support devices or systems only with the express written approval of in?neon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGS13SL9 revision history previous version: v2.3, 2014-02-13 page subjects (major changes since last revision) 10 updated temperature range (table 6) 13 updated tape drawing for tslp-9-3 (figure 5) trademarks of in?neon technologies ag aurix tm , c166 tm , canpak tm , cipos tm , cipurse tm ,coolgan tm ,coolmos tm , coolset tm , coolsic tm , corecontrol tm , dave tm , di-pol tm ,easypim tm , econobridge tm , econodual tm , econopack tm , econopim tm , eicedriver tm , eupec tm , fcos tm , hitfet tm , hybridpack tm , isoface tm , i 2 rf tm , isopack tm , mipaq tm , modstack tm , my-d tm , novalithic tm , omnitune tm , optimos tm , origa tm , optiga tm , profet tm , pro-sil tm , primarion tm , primepack tm , rasic tm , reversave tm , satric tm , sieget tm , sipmos tm , solid flash tm , smartlewis tm , tempfet tm , thinq! tm , tricore tm , trenchstop tm . other trademarks advance design system tm (ads) of agilent technologies, amba tm , arm tm , multi-ice tm , primecell tm , realview tm , thumb tm of arm limited, uk. autosar tm is licensed by autosar development partnership. bluetooth tm of bluetooth sig inc. cat-iq tm of dect forum. colossus tm , firstgps tm of trimble navigation ltd. emv tm of emvco, llc (visa holdings inc.). epcos tm of epcos ag. flexgo tm of microsoft corporation. flexray tm is licensed by flexray consortium. hyperterminal tm of hilgraeve incorporated. iec tm of commission electrotechnique internationale. irda tm of infrared data association corporation. iso tm of international organization for standardization. matlab tm of mathworks, inc. maxim tm of maxim integrated products, inc. microtec tm , nucleus tm of mentor graphics corporation. mifare tm of nxp. mipi tm of mipi alliance, inc. mips tm of mips technologies, inc., usa. murata tm of murata manufacturing co., microwave office tm (mwo) of applied wave research inc., omnivision tm of omnivision technologies, inc. openwave tm openwave systems inc. red hat tm red hat, inc. rfmd tm rf micro devices, inc. sirius tm of sirius sattelite radio inc. solaris tm of sun microsystems, inc. spansion tm of spansion llc ltd. symbian tm of symbian software limited. taiyo yuden tm of taiyo yuden co. teaklite tm of ceva, inc. tektronix tm of tektronix inc. toko tm of toko kabushiki kaisha ta. unix tm of x/open company limited. verilog tm , palladium tm of cadence design systems, inc. vlynq tm of texas instruments incorporated. vxworks tm , wind river tm of wind river systems, inc. zetex tm of diodes zetex limited. last trademarks update 2012-12-13 data sheet 3 revision 2.4, 2014-5-27
BGS13SL9 contents 1 features 7 2 product description 7 3 maximum ratings 9 4 operation ranges 9 5 rf characteristics 10 6 pin description and package outline 12 data sheet 4 revision 2.4, 2014-5-27
BGS13SL9 list of figures 1 BGS13SL9 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 pin 1 marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 footprint tslp-9-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 tape drawing for tslp-9-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 data sheet 5 revision 2.4, 2014-5-27
BGS13SL9 list of tables 1 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 operation ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 rf input power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 rf characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 data sheet 6 revision 2.4, 2014-5-27
BGS13SL9 BGS13SL9 wideband rf sp3t switch 1 features 3 high-linearity trx paths with power handling capability of up to 30 dbm high switching speed, ideal for wlan and bluetooth applications all ports fully bi-directional no decoupling capacitors required if no dc applied on rf lines low insertion loss low harmonic generation high port-to-port-isolation 0.1 to 3 ghz coverage high esd robustness on-chip control logic very small leadless and halogen free package tslp-9-3 (1.15x1.15mm 2 ) with super low height of 0.31mm rohs compliant package 2 product description the BGS13SL9 rf mos switch is speci?cally designed for wlan and bluetooth applications. any of the 3 ports can be used as termination of the diversity antenna handling up to 30 dbm. this sp3t offers low insertion loss and high robustness against interferer signals at the antenna port and low har- monic generation in termination mode. the on-chip controller integrates cmos logic and level shifters, driven by control inputs from 1.5 v to v dd . the BGS13SL9 rf switch is manufactured in in?neons patented mos technology, offering the performance of gaas with the economy and integration of conventional cmos including the inherent higher esd robustness. the device has a very small size of only 1.15 x 1.15 mm 2 and a maximum height of 0.31 mm. no decoupling capacitors are required in typical applications as long as no dc is applied to any rf port. table 1: ordering information type package marking BGS13SL9 tslp-9-3 aa data sheet 7 revision 2.4, 2014-5-27
BGS13SL9 figure 1: BGS13SL9 block diagram table 2: truth table switched paths v1 v2 isolation / all paths open 0 0 rfin - rf1 1 0 rfin - rf2 0 1 rfin - rf3 1 1 data sheet 8 revision 2.4, 2014-5-27 v 1 r f 2 d e c o d e r + e s d p r o t e c t i o n b g s 1 3 s l 9 v 2 v d d d g n d r f i n r f 1 r f 3 s p 3 t
BGS13SL9 3 maximum ratings table 3: maximum ratings at t a = 25 c, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. supply voltage v dd -0.5 C 5.5 v C maximum dc-voltage on other pins v dc -0.3 C 3.6 v C storage temperature range t stg -55 C 150 c C rf input power p rf _ trx C C 32 dbm C junction temperature t j C C 125 c C esd capability human body model 1) v esd _ hbm 1 C +1 kv C esd capability rfin port 2) v esd _ rfin 8 C +8 kv rfin versus gnd, with 27 nh shunt inductor 1) human body model ansi/esda/jedec js-001-2012 ( r = 1.5 k
, c = 100 pf). 2) iec 61000-4-2 ( r = 330
, c = 150 pf), contact discharge. attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to ab- solute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. 4 operation ranges table 4: operation ranges parameter symbol values unit note / test condition min. typ. max. ambient temperature t a -40 25 85 c C rf frequency f 0.1 C 3 ghz C supply voltage v dd 2.3 C 3.6 v C control voltage low v ctrl _ l -0.3 C 0.3 v C control voltage high v ctrl _ h 1.5 C v dd v v dd < 3.3 v table 5: rf input power parameter symbol values unit note / test condition min. typ. max. rf input power (50
) p in C C 30 dbm C data sheet 9 revision 2.4, 2014-5-27
BGS13SL9 5 rf characteristics table 6: rf characteristics test conditions (unless otherwise speci?ed): terminating port impedance: z 0 = 50
temperature range: t a = -40 ... +85 c supply voltage: v dd = 2.3 ... 3.6 v input power: p in = 0 dbm parameter symbol values unit note / test condition min. typ. max. insertion loss all rf ports il 0.24 0.35 0.55 db 824 - 915 mhz 0.28 0.44 0.65 db 1710 - 1910 mhz 0.30 0.50 0.80 db 2170 - 2500 mhz 0.35 0.54 0.90 db 2700 mhz insertion loss 1 all rf ports il 0.30 0.35 0.40 db 824 - 915 mhz 0.37 0.44 0.50 db 1710 - 1910 mhz 0.40 0.50 0.60 db 2170 - 2500 mhz 0.44 0.54 0.70 db 2700 mhz return loss all rf ports rl 21 25 28 db 824 - 915 mhz 15 18 24 db 1710 - 1910 mhz 12 16 22 db 2170 - 2500 mhz 12 14 20 db 2700 mhz isolation rfin to rf1/rf2/rf3 iso in rfx 32 37 44 db 824 - 915 mhz 22 27 33 db 1710 - 1910 mhz 19 24 29 db 2170 - 2500 mhz 18 22 27 db 2700 mhz rf1 to rf2 / rf2 to rf1 iso port port 32 42 49 db 824 - 915 mhz rf1 to rf3 / rf3 to rf1 24 31 36 db 1710 - 1910 mhz rf2 to rf3 / rf3 to rf2 21 27 32 db 2170 - 2500 mhz 20 26 31 db 2700 mhz 1 t a = +25 c, v dd = 3 v data sheet 10 revision 2.4, 2014-5-27
BGS13SL9 parameter symbol values unit note / test condition min. typ. max. harmonic generation up to 12.75 ghz any path p harm C -80 -70 dbc p in = 27 dbm , 50 % duty cy- cle, 50
intermodulation distortion in rx band 1,2 imd2 imd 2 C -110 -105 dbm tx = 10 dbm, interferer = -15 dbm, 50
imd3 imd 3 C -115 -105 dbm switching time and current consumption rf rise time t 10% 90% C 23 90 ns 10% - 90% of rf signal ctrl to rf time t ctrl rf C 95 250 ns 50% of ctrl signal to 90% of rf signal supply current i dd C 140 270 a C control current i ctrl C 1 10 a C note: all electrical characteristics are measured with all rf ports terminated by 50
loads. 1 t a = +25 c, v dd = 3 v 2 with external shunt l data sheet 11 revision 2.4, 2014-5-27
BGS13SL9 6 pin description and package outline table 7: mechanical data parameter symbol value unit x-dimension x 1.15 0.05 mm y-dimension y 1.15 0.05 mm size size 1.3225 mm 2 height h 0.31 +0.01/ 0.02 mm table 8: pin description pin no. name pin type buffer type function 1 v1 i control pin 1 2 rf3 i/o rf-port 3 3 rf1 i/o rf-port 1 4 rfin i/o rf input 5 rf2 i/o rf-port 2 6 dgnd gnd digital ground 7 vdd pwr power supply 8 v2 i control pin 2 9 gnd gnd ground figure 2: package outline data sheet 12 revision 2.4, 2014-5-27 tslp-9-3-po v01 0.05 max. +0.01 0.31 -0.02 pin 1 marking 1) dimension applies to plated terminals bottom view top view 1.15 0.05 1.15 0.05 0.2 0.035 1) 0.2 0.035 1) 3 4 5 6 2 1 8 9 7 0.4 0.4 2 x 0.4 = 0.8 2 x 0.4 = 0.8
BGS13SL9 figure 3: pin 1 marking (top view) figure 4: footprint tslp-9-3 figure 5: tape drawing for tslp-9-3 data sheet 13 revision 2.4, 2014-5-27 stencil apertures copper solder mask tslp-9-3-fp v01 0.25 0.25 0.4 0.4 0.4 0.4 0.25 (stencil thickness 100 m)
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